Serruys, Y.

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  • Serruys, Y. (4)
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Author's Bibliography

Deposition on thin SiO2 layer by reactive sputtering

Radović, Ivan; Serruys, Y.; Limoge, Y.; Milosavljević, Momir; Romčević, Nebojša Ž.; Bibić, Nataša M.

(2007)

TY  - JOUR
AU  - Radović, Ivan
AU  - Serruys, Y.
AU  - Limoge, Y.
AU  - Milosavljević, Momir
AU  - Romčević, Nebojša Ž.
AU  - Bibić, Nataša M.
PY  - 2007
UR  - https://vinar.vin.bg.ac.rs/handle/123456789/3374
AB  - We investigate the experimental possibilities for producing high purity stoichiometric SiO2 thin films by reactive ion beam sputtering. The layers were deposited in a UHV chamber ( base pressure 4 x 10(-9) mbar) by 1 keV Ar+ ions for sputtering from a high purity silicon target, using different values of the oxygen partial pressure ( 5 x 10(-6) -1 x 10(-3) mbar) and of the ion beam current on the target (1.67 - 6.85 mA). The argon partial pressure during ion gun operation was 1 x 10(-3) mbar. The substrates were held at room temperature or at 550 degrees C, and the films were deposited to 12.5 - 150 nm, at a rate from 0.0018 - 0.035 nm/s. To perform structural characterization we used Rutherford backscattering spectrometry, electron microprobe, X-ray diffraction and Raman spectroscopy. From the results it is clear that reactive ion beam sputtering proved to be efficient for deposition of high quality silica films at 550 degrees C, oxygen partial pressure of 2 x 10(-4) mbar ( ion beam current on the target from 5 to 5.5 mA) or at a lower deposition rate, ion beam current of 1.67 mA and oxygen partial pressure of 6 x 10(-5) mbar. The aim of these investigations was also to study the consumption of oxygen from the gas cylinder. We found that it is lower for higher deposition rates.
T2  - Optoelectronics and Advanced Materials - Rapid Communications
T1  - Deposition on thin SiO2 layer by reactive sputtering
VL  - 1
IS  - 5
SP  - 247
EP  - 251
UR  - https://hdl.handle.net/21.15107/rcub_vinar_3374
ER  - 
@article{
author = "Radović, Ivan and Serruys, Y. and Limoge, Y. and Milosavljević, Momir and Romčević, Nebojša Ž. and Bibić, Nataša M.",
year = "2007",
abstract = "We investigate the experimental possibilities for producing high purity stoichiometric SiO2 thin films by reactive ion beam sputtering. The layers were deposited in a UHV chamber ( base pressure 4 x 10(-9) mbar) by 1 keV Ar+ ions for sputtering from a high purity silicon target, using different values of the oxygen partial pressure ( 5 x 10(-6) -1 x 10(-3) mbar) and of the ion beam current on the target (1.67 - 6.85 mA). The argon partial pressure during ion gun operation was 1 x 10(-3) mbar. The substrates were held at room temperature or at 550 degrees C, and the films were deposited to 12.5 - 150 nm, at a rate from 0.0018 - 0.035 nm/s. To perform structural characterization we used Rutherford backscattering spectrometry, electron microprobe, X-ray diffraction and Raman spectroscopy. From the results it is clear that reactive ion beam sputtering proved to be efficient for deposition of high quality silica films at 550 degrees C, oxygen partial pressure of 2 x 10(-4) mbar ( ion beam current on the target from 5 to 5.5 mA) or at a lower deposition rate, ion beam current of 1.67 mA and oxygen partial pressure of 6 x 10(-5) mbar. The aim of these investigations was also to study the consumption of oxygen from the gas cylinder. We found that it is lower for higher deposition rates.",
journal = "Optoelectronics and Advanced Materials - Rapid Communications",
title = "Deposition on thin SiO2 layer by reactive sputtering",
volume = "1",
number = "5",
pages = "247-251",
url = "https://hdl.handle.net/21.15107/rcub_vinar_3374"
}
Radović, I., Serruys, Y., Limoge, Y., Milosavljević, M., Romčević, N. Ž.,& Bibić, N. M.. (2007). Deposition on thin SiO2 layer by reactive sputtering. in Optoelectronics and Advanced Materials - Rapid Communications, 1(5), 247-251.
https://hdl.handle.net/21.15107/rcub_vinar_3374
Radović I, Serruys Y, Limoge Y, Milosavljević M, Romčević NŽ, Bibić NM. Deposition on thin SiO2 layer by reactive sputtering. in Optoelectronics and Advanced Materials - Rapid Communications. 2007;1(5):247-251.
https://hdl.handle.net/21.15107/rcub_vinar_3374 .
Radović, Ivan, Serruys, Y., Limoge, Y., Milosavljević, Momir, Romčević, Nebojša Ž., Bibić, Nataša M., "Deposition on thin SiO2 layer by reactive sputtering" in Optoelectronics and Advanced Materials - Rapid Communications, 1, no. 5 (2007):247-251,
https://hdl.handle.net/21.15107/rcub_vinar_3374 .
3

Stoichiometric SiO2 thin films deposited by reactive sputtering

Radović, Ivan; Serruys, Y.; Limoge, Y.; Bibić, Nataša M.; Poissonnet, S.; Jaoul, O.; Mitrić, Miodrag; Romčević, Nebojša Ž.; Milosavljević, Momir

(2007)

TY  - JOUR
AU  - Radović, Ivan
AU  - Serruys, Y.
AU  - Limoge, Y.
AU  - Bibić, Nataša M.
AU  - Poissonnet, S.
AU  - Jaoul, O.
AU  - Mitrić, Miodrag
AU  - Romčević, Nebojša Ž.
AU  - Milosavljević, Momir
PY  - 2007
UR  - https://vinar.vin.bg.ac.rs/handle/123456789/3208
AB  - We report a study of experimental possibilities to produce high purity stoichiometric SiO2 thin films by reactive ion beam sputtering. The films were deposited in a UHV chamber, 4 x 10(-9) mbar, using a high purity silicon target and 1 keV Ar+ ions for sputtering. The ion beam current was varied from 1.67 to 6.85 mA, at a constant argon partial pressure of 1 X 10(-3) mbar. Different values of the oxygen partial pressure (5 x 10(-6)-1 X 10(-3) mbar) were applied for reactive deposition. The substrates were held at room temperature or at 550 degrees C, and the films were deposited to 12.5-150nm, at 0.0018-0.035nms(-1). Structural characterization was performed by Rutherford backscattering spectrometry (RBS), electron microprobe, X-ray diffraction (XRD) and Raman spectroscopy. The results show that reactive ion beam sputtering can be efficient for deposition of high quality silica films at 550 degrees C, oxygen partial pressure of 2 x 10(-4) mbar and ion beam current on the target from 5 to 5.5 mA, or at a lower deposition rate, ion beam current of 1.67 mA and oxygen partial pressure of 6 x 10(-5) mbar. One aspect of these investigations was to study consumption of oxygen from the gas cylinder, which was found to be lower for higher deposition rates. (c) 2007 Elsevier B.V. All rights reserved.
T2  - Materials Chemistry and Physics
T1  - Stoichiometric SiO2 thin films deposited by reactive sputtering
VL  - 104
IS  - 1
SP  - 172
EP  - 176
DO  - 10.1016/j.matchemphys.2007.03.006
ER  - 
@article{
author = "Radović, Ivan and Serruys, Y. and Limoge, Y. and Bibić, Nataša M. and Poissonnet, S. and Jaoul, O. and Mitrić, Miodrag and Romčević, Nebojša Ž. and Milosavljević, Momir",
year = "2007",
abstract = "We report a study of experimental possibilities to produce high purity stoichiometric SiO2 thin films by reactive ion beam sputtering. The films were deposited in a UHV chamber, 4 x 10(-9) mbar, using a high purity silicon target and 1 keV Ar+ ions for sputtering. The ion beam current was varied from 1.67 to 6.85 mA, at a constant argon partial pressure of 1 X 10(-3) mbar. Different values of the oxygen partial pressure (5 x 10(-6)-1 X 10(-3) mbar) were applied for reactive deposition. The substrates were held at room temperature or at 550 degrees C, and the films were deposited to 12.5-150nm, at 0.0018-0.035nms(-1). Structural characterization was performed by Rutherford backscattering spectrometry (RBS), electron microprobe, X-ray diffraction (XRD) and Raman spectroscopy. The results show that reactive ion beam sputtering can be efficient for deposition of high quality silica films at 550 degrees C, oxygen partial pressure of 2 x 10(-4) mbar and ion beam current on the target from 5 to 5.5 mA, or at a lower deposition rate, ion beam current of 1.67 mA and oxygen partial pressure of 6 x 10(-5) mbar. One aspect of these investigations was to study consumption of oxygen from the gas cylinder, which was found to be lower for higher deposition rates. (c) 2007 Elsevier B.V. All rights reserved.",
journal = "Materials Chemistry and Physics",
title = "Stoichiometric SiO2 thin films deposited by reactive sputtering",
volume = "104",
number = "1",
pages = "172-176",
doi = "10.1016/j.matchemphys.2007.03.006"
}
Radović, I., Serruys, Y., Limoge, Y., Bibić, N. M., Poissonnet, S., Jaoul, O., Mitrić, M., Romčević, N. Ž.,& Milosavljević, M.. (2007). Stoichiometric SiO2 thin films deposited by reactive sputtering. in Materials Chemistry and Physics, 104(1), 172-176.
https://doi.org/10.1016/j.matchemphys.2007.03.006
Radović I, Serruys Y, Limoge Y, Bibić NM, Poissonnet S, Jaoul O, Mitrić M, Romčević NŽ, Milosavljević M. Stoichiometric SiO2 thin films deposited by reactive sputtering. in Materials Chemistry and Physics. 2007;104(1):172-176.
doi:10.1016/j.matchemphys.2007.03.006 .
Radović, Ivan, Serruys, Y., Limoge, Y., Bibić, Nataša M., Poissonnet, S., Jaoul, O., Mitrić, Miodrag, Romčević, Nebojša Ž., Milosavljević, Momir, "Stoichiometric SiO2 thin films deposited by reactive sputtering" in Materials Chemistry and Physics, 104, no. 1 (2007):172-176,
https://doi.org/10.1016/j.matchemphys.2007.03.006 . .
4
3
3

Analysis of SiO2 thin film deposited by reactive sputtering

Radović, Ivan; Serruys, Y.; Limoge, Y.; Jaoul, O.; Romčević, Nebojša Ž.; Poissonnet, S.; Bibić, Nataša M.

(2006)

TY  - JOUR
AU  - Radović, Ivan
AU  - Serruys, Y.
AU  - Limoge, Y.
AU  - Jaoul, O.
AU  - Romčević, Nebojša Ž.
AU  - Poissonnet, S.
AU  - Bibić, Nataša M.
PY  - 2006
UR  - https://vinar.vin.bg.ac.rs/handle/123456789/6599
AB  - SiO2 layers were deposited by reactive d.c ion sputtering (using 1 keV Ar+ ion gun) from a high purity silicon target in an oxygen ambient. The base pressure in the deposition chamber was 4.7-10(-9) mbar, and the substrate temperature was held at 550 degrees C. The argon partial pressure during ion gun operation was 1-10(-3) mbar. Structural characterization of the films was performed by Rutherford backscattering spectrometry (RBS analysis), electron microprobe analysis, X-ray diffraction (XRD analysis) and Raman spectroscopy. Reactive sputtering proved to be efficient for the deposition of silica at an oxygen partial pressure of 2-10(-4) mbar and an electrical current on the target of 5.5mA.
T2  - Materials Science Forum
T1  - Analysis of SiO2 thin film deposited by reactive sputtering
VL  - 518
SP  - 149
EP  - 154
DO  - 10.4028/www.scientific.net/MSF.518.149
ER  - 
@article{
author = "Radović, Ivan and Serruys, Y. and Limoge, Y. and Jaoul, O. and Romčević, Nebojša Ž. and Poissonnet, S. and Bibić, Nataša M.",
year = "2006",
abstract = "SiO2 layers were deposited by reactive d.c ion sputtering (using 1 keV Ar+ ion gun) from a high purity silicon target in an oxygen ambient. The base pressure in the deposition chamber was 4.7-10(-9) mbar, and the substrate temperature was held at 550 degrees C. The argon partial pressure during ion gun operation was 1-10(-3) mbar. Structural characterization of the films was performed by Rutherford backscattering spectrometry (RBS analysis), electron microprobe analysis, X-ray diffraction (XRD analysis) and Raman spectroscopy. Reactive sputtering proved to be efficient for the deposition of silica at an oxygen partial pressure of 2-10(-4) mbar and an electrical current on the target of 5.5mA.",
journal = "Materials Science Forum",
title = "Analysis of SiO2 thin film deposited by reactive sputtering",
volume = "518",
pages = "149-154",
doi = "10.4028/www.scientific.net/MSF.518.149"
}
Radović, I., Serruys, Y., Limoge, Y., Jaoul, O., Romčević, N. Ž., Poissonnet, S.,& Bibić, N. M.. (2006). Analysis of SiO2 thin film deposited by reactive sputtering. in Materials Science Forum, 518, 149-154.
https://doi.org/10.4028/www.scientific.net/MSF.518.149
Radović I, Serruys Y, Limoge Y, Jaoul O, Romčević NŽ, Poissonnet S, Bibić NM. Analysis of SiO2 thin film deposited by reactive sputtering. in Materials Science Forum. 2006;518:149-154.
doi:10.4028/www.scientific.net/MSF.518.149 .
Radović, Ivan, Serruys, Y., Limoge, Y., Jaoul, O., Romčević, Nebojša Ž., Poissonnet, S., Bibić, Nataša M., "Analysis of SiO2 thin film deposited by reactive sputtering" in Materials Science Forum, 518 (2006):149-154,
https://doi.org/10.4028/www.scientific.net/MSF.518.149 . .

Determination of the experimental conditions for SiO2 deposition by reactive sputtering

Radović, Ivan; Serruys, Y.; Limoge, Y.; Jaoul, O.; Poissonnet, S.; Bibić, Nataša

(Čačak : Technical Faculty, 2005)

TY  - CONF
AU  - Radović, Ivan
AU  - Serruys, Y.
AU  - Limoge, Y.
AU  - Jaoul, O.
AU  - Poissonnet, S.
AU  - Bibić, Nataša
PY  - 2005
UR  - https://vinar.vin.bg.ac.rs/handle/123456789/12849
PB  - Čačak : Technical Faculty
C3  - VI Scientific Meeting Physics and Technology of Materials - FITEM '05
T1  - Determination of the experimental conditions for SiO2 deposition by reactive sputtering
SP  - 19
EP  - 19
UR  - https://hdl.handle.net/21.15107/rcub_vinar_12849
ER  - 
@conference{
author = "Radović, Ivan and Serruys, Y. and Limoge, Y. and Jaoul, O. and Poissonnet, S. and Bibić, Nataša",
year = "2005",
publisher = "Čačak : Technical Faculty",
journal = "VI Scientific Meeting Physics and Technology of Materials - FITEM '05",
title = "Determination of the experimental conditions for SiO2 deposition by reactive sputtering",
pages = "19-19",
url = "https://hdl.handle.net/21.15107/rcub_vinar_12849"
}
Radović, I., Serruys, Y., Limoge, Y., Jaoul, O., Poissonnet, S.,& Bibić, N.. (2005). Determination of the experimental conditions for SiO2 deposition by reactive sputtering. in VI Scientific Meeting Physics and Technology of Materials - FITEM '05
Čačak : Technical Faculty., 19-19.
https://hdl.handle.net/21.15107/rcub_vinar_12849
Radović I, Serruys Y, Limoge Y, Jaoul O, Poissonnet S, Bibić N. Determination of the experimental conditions for SiO2 deposition by reactive sputtering. in VI Scientific Meeting Physics and Technology of Materials - FITEM '05. 2005;:19-19.
https://hdl.handle.net/21.15107/rcub_vinar_12849 .
Radović, Ivan, Serruys, Y., Limoge, Y., Jaoul, O., Poissonnet, S., Bibić, Nataša, "Determination of the experimental conditions for SiO2 deposition by reactive sputtering" in VI Scientific Meeting Physics and Technology of Materials - FITEM '05 (2005):19-19,
https://hdl.handle.net/21.15107/rcub_vinar_12849 .