A particle-in-cell simulation of the high-field effect in devices with micrometer gaps
Apstrakt
Devices with micrometer and submicrometer gaps can face a serious challenge due to electrical breakdown during manufacturing, handling, and operation. Therefore, it is necessary to be aware of the breakdown voltage at different gaps. Since the Paschens law is not valid for gaps smaller than several micrometers, modified Paschen curve should be used to predict breakdown voltage for microdevices. One of the possible mechanisms responsible for the reduction of the maximum operation voltage at small gaps is the field emission (FE). In this paper, particle-in-cell/Monte Carlo collision simulations, including the ejection of electrons from the cathode due to a high electric field, have been carried out to estimate the significance of the FE effect on the breakdown voltage in microgaps.
Ključne reči:
field emission (FE) / microdischarges / microgap / simulationIzvor:
IEEE Transactions on Plasma Science, 2007, 35, 5, 1223-1228
DOI: 10.1109/TPS.2007.906125
ISSN: 0093-3813
WoS: 000250993200006
Scopus: 2-s2.0-35348854388
Kolekcije
Institucija/grupa
VinčaTY - JOUR AU - Radmilovi-Radjenovic, Marija AU - Rađenović, Branislav PY - 2007 UR - https://vinar.vin.bg.ac.rs/handle/123456789/3317 AB - Devices with micrometer and submicrometer gaps can face a serious challenge due to electrical breakdown during manufacturing, handling, and operation. Therefore, it is necessary to be aware of the breakdown voltage at different gaps. Since the Paschens law is not valid for gaps smaller than several micrometers, modified Paschen curve should be used to predict breakdown voltage for microdevices. One of the possible mechanisms responsible for the reduction of the maximum operation voltage at small gaps is the field emission (FE). In this paper, particle-in-cell/Monte Carlo collision simulations, including the ejection of electrons from the cathode due to a high electric field, have been carried out to estimate the significance of the FE effect on the breakdown voltage in microgaps. T2 - IEEE Transactions on Plasma Science T1 - A particle-in-cell simulation of the high-field effect in devices with micrometer gaps VL - 35 IS - 5 SP - 1223 EP - 1228 DO - 10.1109/TPS.2007.906125 ER -
@article{ author = "Radmilovi-Radjenovic, Marija and Rađenović, Branislav", year = "2007", abstract = "Devices with micrometer and submicrometer gaps can face a serious challenge due to electrical breakdown during manufacturing, handling, and operation. Therefore, it is necessary to be aware of the breakdown voltage at different gaps. Since the Paschens law is not valid for gaps smaller than several micrometers, modified Paschen curve should be used to predict breakdown voltage for microdevices. One of the possible mechanisms responsible for the reduction of the maximum operation voltage at small gaps is the field emission (FE). In this paper, particle-in-cell/Monte Carlo collision simulations, including the ejection of electrons from the cathode due to a high electric field, have been carried out to estimate the significance of the FE effect on the breakdown voltage in microgaps.", journal = "IEEE Transactions on Plasma Science", title = "A particle-in-cell simulation of the high-field effect in devices with micrometer gaps", volume = "35", number = "5", pages = "1223-1228", doi = "10.1109/TPS.2007.906125" }
Radmilovi-Radjenovic, M.,& Rađenović, B.. (2007). A particle-in-cell simulation of the high-field effect in devices with micrometer gaps. in IEEE Transactions on Plasma Science, 35(5), 1223-1228. https://doi.org/10.1109/TPS.2007.906125
Radmilovi-Radjenovic M, Rađenović B. A particle-in-cell simulation of the high-field effect in devices with micrometer gaps. in IEEE Transactions on Plasma Science. 2007;35(5):1223-1228. doi:10.1109/TPS.2007.906125 .
Radmilovi-Radjenovic, Marija, Rađenović, Branislav, "A particle-in-cell simulation of the high-field effect in devices with micrometer gaps" in IEEE Transactions on Plasma Science, 35, no. 5 (2007):1223-1228, https://doi.org/10.1109/TPS.2007.906125 . .