Приказ основних података о документу

dc.creatorMladenović, Ivana
dc.creatorVuksanović, Marija
dc.creatorJovanov, Vladislav
dc.creatorRadovanović, Željko
dc.creatorObradov Marko
dc.creatorNikolić, Nebojša D.
dc.creatorVasiljević Radović, Dana
dc.date.accessioned2024-01-15T09:23:18Z
dc.date.available2024-01-15T09:23:18Z
dc.date.issued2023
dc.identifier.isbn979-8-3503-4776-0
dc.identifier.urihttps://vinar.vin.bg.ac.rs/handle/123456789/12449
dc.description.abstractElectrochemically deposited nickel coatings fromsulfamate baths without/with lab-made biosilica (SiO2) particles onthe Si(100) substrate were produced. Different galvanostaticregimes were used: direct current (DC), pulse current (PC), andpulse-reverse current (PRC) regimes. The phase structure of thesynthesized silica nanoparticles from rice husks was obtained usingXRD and FE-SEM. The MMC-Ni/SiO2 and free Ni coatings werecharacterized using FE-SEM, AFM, the micro indentation Vickerstechnique, and the drop sessile method in order to investigatestructure, roughness, microhardness, and wettability. The optimaldeposition parameters were obtained with an emphasis on theirpotential application as micro mounting coatings.en
dc.language.isoen
dc.publisherElectron Devices Society of the IInstitute of electrical and electronics engineers, inc.
dc.relationinfo:eu-repo/grantAgreement/MESTD/inst-2020/200026/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/inst-2020/200017/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/inst-2020/200287/RS//
dc.rightsrestrictedAccess
dc.sourceMIEL : 33rd International Conference on Microelectronics : Proceedings book
dc.subjectbiosilicaen
dc.subjectelectrodepositionen
dc.subjectcomposite materialsen
dc.subjectmechanical propertiesen
dc.subjectmetal matrix coatingsen
dc.titleMetal Matrix Composite Coatings Based on Ni Matrix and Biosilica Filers Obtained from Rice Husksen
dc.typeconferenceObject
dc.rights.licenseARR
dc.citation.spage241
dc.citation.epage244
dc.identifier.doi10.1109/MIEL58498.2023.10315914
dc.description.otherMIEL : 33nd International Conference on Microelectronics; October 16-18, 2023, Niš, Serbia
dc.type.versionpublishedVersionsr
dc.identifier.scopus2-s2.0-85181640141


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