Serpa, Cristina

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orcid::0000-0002-8561-118X
  • Serpa, Cristina (1)
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Author's Bibliography

Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure

Radović, Ivana M.; Stajčić, Aleksandar P.; Mitić, Vojislav V.; Serpa, Cristina; Paunović, Vesna; Ranđelović, Branislav

(2021)

TY  - CONF
AU  - Radović, Ivana M.
AU  - Stajčić, Aleksandar P.
AU  - Mitić, Vojislav V.
AU  - Serpa, Cristina
AU  - Paunović, Vesna
AU  - Ranđelović, Branislav
PY  - 2021
UR  - https://vinar.vin.bg.ac.rs/handle/123456789/10019
AB  - In the past century, the use of polymers and composites with a polymer matrix has expanded to such a level that today it is impossible to imagine life without these materials. Epoxy resin and epoxy-based composites are widely used as construction materials, due to their excellent adhesion, thermal and chemical stability. Fractal nature analysis can provide insight in morphological changes at fiber-matrix interface level, which could give direction for the processing of composites. This mathematical technique can be performed on field emission scanning electron microscopy (FESEM) images, by identifying fiber phase and pores shapes and boundaries, as well as fiber-matrix bonding at the interface. In this study, fiberglass mat was used for the reinforcement of epoxy. FESEM image of enlarged fiber after the composite fracture was used for the reconstruction of data. With the use of affine fractal regression model, software Fractal Real Finder was employed for the reconstruction of fiber shape and the determination of Hausdorff dimension. © 2021 IEEE.
C3  - Proceedings of the International Conference on Microelectronics, ICM
T1  - Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure
VL  - September
SP  - 203
EP  - 206
DO  - 10.1109/MIEL52794.2021.9569054
ER  - 
@conference{
author = "Radović, Ivana M. and Stajčić, Aleksandar P. and Mitić, Vojislav V. and Serpa, Cristina and Paunović, Vesna and Ranđelović, Branislav",
year = "2021",
abstract = "In the past century, the use of polymers and composites with a polymer matrix has expanded to such a level that today it is impossible to imagine life without these materials. Epoxy resin and epoxy-based composites are widely used as construction materials, due to their excellent adhesion, thermal and chemical stability. Fractal nature analysis can provide insight in morphological changes at fiber-matrix interface level, which could give direction for the processing of composites. This mathematical technique can be performed on field emission scanning electron microscopy (FESEM) images, by identifying fiber phase and pores shapes and boundaries, as well as fiber-matrix bonding at the interface. In this study, fiberglass mat was used for the reinforcement of epoxy. FESEM image of enlarged fiber after the composite fracture was used for the reconstruction of data. With the use of affine fractal regression model, software Fractal Real Finder was employed for the reconstruction of fiber shape and the determination of Hausdorff dimension. © 2021 IEEE.",
journal = "Proceedings of the International Conference on Microelectronics, ICM",
title = "Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure",
volume = "September",
pages = "203-206",
doi = "10.1109/MIEL52794.2021.9569054"
}
Radović, I. M., Stajčić, A. P., Mitić, V. V., Serpa, C., Paunović, V.,& Ranđelović, B.. (2021). Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure. in Proceedings of the International Conference on Microelectronics, ICM, September, 203-206.
https://doi.org/10.1109/MIEL52794.2021.9569054
Radović IM, Stajčić AP, Mitić VV, Serpa C, Paunović V, Ranđelović B. Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure. in Proceedings of the International Conference on Microelectronics, ICM. 2021;September:203-206.
doi:10.1109/MIEL52794.2021.9569054 .
Radović, Ivana M., Stajčić, Aleksandar P., Mitić, Vojislav V., Serpa, Cristina, Paunović, Vesna, Ranđelović, Branislav, "Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure" in Proceedings of the International Conference on Microelectronics, ICM, September (2021):203-206,
https://doi.org/10.1109/MIEL52794.2021.9569054 . .
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