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dc.creatorPošarac, Milica B.
dc.creatorDimitrijevic, M.
dc.creatorMajstorovic, J.
dc.creatorVolkov-Husović, Tatjana
dc.creatorMatović, Branko
dc.date.accessioned2018-03-01T21:03:44Z
dc.date.available2018-03-01T21:03:44Z
dc.date.issued2010
dc.identifier.issn0934-9847 (print)
dc.identifier.urihttp://vinar.vin.bg.ac.rs/handle/123456789/3886
dc.description.abstractTwo different types cordierite/silicon carbide composite ceramic materials (KS 50 and KZ 50) were used for this investigation. Both materials were exposed to the water quench test from 950 degrees C, applying various numbers of thermal cycles. When refractory samples are subjected to the rapid temperature changes crack nucleation and propagation occurs resulting in loss of strength and materials degradation. The formation of cracks decreases the density and elastic properties of material. Therefore, measuring these properties can directly monitor the development of thermal shock damage level. Dynamic Young modulus of elasticity and strength degradation were calculated using measured values of ultrasonic velocities obtained by ultrasonic measurements. Level of degradation of the samples was monitored before and during testing using Image Pro Plus program for image analysis. The capability of ultrasonic velocity technique and image analysis for simple and reliable nondestructive methods of characterization was presented in this investigation. It was found that both composite materials exhibit good thermal shock resistance.en
dc.rightsrestrictedAccessen
dc.sourceResearch in Nondestructive Evaluationen
dc.subjectcordieriteen
dc.subjectSiC composite ceramicsen
dc.subjectimage analysisen
dc.subjectrefractoriesen
dc.subjectthermal shock resistanceen
dc.subjectultrasonic velocityen
dc.titleNondestructive Testing of Thermal Shock Resistance of Cordierite/Silicon Carbide Composite Materials After Cyclic Thermal Shocken
dc.typearticleen
dcterms.abstractПошарац-Марковић Милица; Матовић Бранко; Димитријевиц, М.; Мајсторовиц, Ј.; Волков-Хусовиц, Т.;
dc.citation.volume21
dc.citation.issue1
dc.citation.spage48
dc.citation.epage59
dc.identifier.wos000274169900004
dc.identifier.doi10.1080/09349840903381044
dc.citation.otherArticle Number: PII 918983670
dc.citation.rankM23
dc.identifier.scopus2-s2.0-76349100744


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