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dc.creatorCerovic, Ljiljana
dc.creatorLefevre, Gregory
dc.creatorJaubertie, Anne
dc.creatorFedoroff, Michel
dc.creatorMilonjić, Slobodan K.
dc.date.accessioned2018-03-01T20:40:52Z
dc.date.available2018-03-01T20:40:52Z
dc.date.issued2009
dc.identifier.issn0021-9797
dc.identifier.urihttps://vinar.vin.bg.ac.rs/handle/123456789/3623
dc.description.abstractAn experimental circulating water loop has been constructed to study the deposition of hematite particles of average diameter 320 nm on polypropylene pipe walls in the ranges pH 4-11, Re 3300-17,700 at 25 degrees C. Real-time turbidimetric measurements were used to measure the deposited concentrations. Results showed that the deposition rate increased when pH decreased and when the flow rate increased. Adhesion was observed even under repulsive electrostatic conditions (pH GT 7), where the surfaces of hematite and polypropylene were both negative, indicating that the kinetic energy of at least a part of the particles Surpassed the electrostatic repulsive potentials. The experimental Curves Were fitted by a model assuming simultaneous adhesion and removal of particles, leading to adhesion and removal rate constants, whose values depend on pH and flow rate. Removal is negligible below pH 9. (c) 2008 Elsevier Inc. All rights reserved.en
dc.relationFrench National Research Agency (ANR) [ANR-05-BLAN-0124-01], Ministry of Science of the Republic of Serbia [142004]
dc.rightsrestrictedAccessen
dc.sourceJournal of Colloid and Interface Scienceen
dc.subjectHematiteen
dc.subjectParticleen
dc.subjectDepositionen
dc.subjectTransport processesen
dc.subjectColloidsen
dc.subjectKineticsen
dc.subjectAdhesionen
dc.subjectTurbulent flowen
dc.titleDeposition of hematite particles on polypropylene walls in dynamic conditionsen
dc.typearticleen
dcterms.abstractЦеровиц, Љиљана; Лефевре, Грегорy; Јаубертие, Aнне; Федорофф, Мицхел; Милоњић Слободан;
dc.citation.volume330
dc.citation.issue2
dc.citation.spage284
dc.citation.epage291
dc.identifier.wos000262760600004
dc.identifier.doi10.1016/j.jcis.2008.10.079
dc.citation.rankM22
dc.identifier.pmid19056091
dc.identifier.scopus2-s2.0-57649099034


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