Copper Electrodeposition onto Palladium from a Deep Eutectic System Based on Choline Chloride
Аутори
Cvetković, Vesna S.Nikolić, Nebojša D.
Košević, Milica
Barudžija, Tanja
Dimitrijević, Silvana B.
Jovićević, Jovan N.
Конференцијски прилог (Објављена верзија)
Метаподаци
Приказ свих података о документуАпстракт
Recently, there has been an increasing interest in developing nonaqueous electrolytes which have been widely employed as an alternative media for a range of metals and metal alloys electrodepositions. A promising and new class of electrolytes among ionic liquids (Ils) are deep eutectic solvents (DESs)1 . The purpose of the copper deposition study from DESs is the application of copper coating and copper alloys in both, industry and fundamental research. In this work, the electrochemical deposition of copper onto palladium working substrate from ChCl/EG (1:2 ratio) DES electrolyte at 50°C was investigated. Additionally, the Cu(II) electroreduction process was studied by potentiodynamic measurements, cyclic voltammetry, chronoamperometry, in the electrolytes with different concentrations of Cu(II) ions ranging from 0.1 M to 0.5 M. The cyclic voltammetry results indicated that the bulk deposition of Cu(II) begins to occur at around –0.080 V vs. Cu. It was found that copper deposition onto... the Pd cathode from ChCl:EG electrolyte under potentiostatic conditions is achievable. Data collected from X-ray diffraction (XRD) analysis proved that the cathodic deposits are composed of Cu and CuPd intermetallic. CuPd alloys with different Pd-Cu ratios were prepared by constant potential of –0.100 V vs. Cu from ChCl/EG containing 0.1 M and 0.5 M Cu(II). It is worth noting that the Xray data indicated that the composition of the produced Pd-Cu films could be varied by changing the concentration of Cu(II) ions in the electrolyte or changing the deposition mode.
Кључне речи:
deep eutectic solvents(DESs) / Cu-Pd alloys / electrodepositionИзвор:
26th Congress of the Society of Chemists and Technologists of Macedonia : the book of abstracts; September 20-23, Ohrid, Macedonia, 2023, 139-139Издавач:
- Society of Chemists and Technologists of Macedonia
Финансирање / пројекти:
- Министарство науке, технолошког развоја и иновација Републике Србије, институционално финансирање - 200026 (Универзитет у Београду, Институт за хемију, технологију и металургију - ИХТМ) (RS-MESTD-inst-2020-200026)
Колекције
Институција/група
VinčaTY - CONF AU - Cvetković, Vesna S. AU - Nikolić, Nebojša D. AU - Košević, Milica AU - Barudžija, Tanja AU - Dimitrijević, Silvana B. AU - Jovićević, Jovan N. PY - 2023 UR - https://vinar.vin.bg.ac.rs/handle/123456789/11760 AB - Recently, there has been an increasing interest in developing nonaqueous electrolytes which have been widely employed as an alternative media for a range of metals and metal alloys electrodepositions. A promising and new class of electrolytes among ionic liquids (Ils) are deep eutectic solvents (DESs)1 . The purpose of the copper deposition study from DESs is the application of copper coating and copper alloys in both, industry and fundamental research. In this work, the electrochemical deposition of copper onto palladium working substrate from ChCl/EG (1:2 ratio) DES electrolyte at 50°C was investigated. Additionally, the Cu(II) electroreduction process was studied by potentiodynamic measurements, cyclic voltammetry, chronoamperometry, in the electrolytes with different concentrations of Cu(II) ions ranging from 0.1 M to 0.5 M. The cyclic voltammetry results indicated that the bulk deposition of Cu(II) begins to occur at around –0.080 V vs. Cu. It was found that copper deposition onto the Pd cathode from ChCl:EG electrolyte under potentiostatic conditions is achievable. Data collected from X-ray diffraction (XRD) analysis proved that the cathodic deposits are composed of Cu and CuPd intermetallic. CuPd alloys with different Pd-Cu ratios were prepared by constant potential of –0.100 V vs. Cu from ChCl/EG containing 0.1 M and 0.5 M Cu(II). It is worth noting that the Xray data indicated that the composition of the produced Pd-Cu films could be varied by changing the concentration of Cu(II) ions in the electrolyte or changing the deposition mode. PB - Society of Chemists and Technologists of Macedonia C3 - 26th Congress of the Society of Chemists and Technologists of Macedonia : the book of abstracts; September 20-23, Ohrid, Macedonia T1 - Copper Electrodeposition onto Palladium from a Deep Eutectic System Based on Choline Chloride SP - 139 EP - 139 UR - https://hdl.handle.net/21.15107/rcub_vinar_11760 ER -
@conference{ author = "Cvetković, Vesna S. and Nikolić, Nebojša D. and Košević, Milica and Barudžija, Tanja and Dimitrijević, Silvana B. and Jovićević, Jovan N.", year = "2023", abstract = "Recently, there has been an increasing interest in developing nonaqueous electrolytes which have been widely employed as an alternative media for a range of metals and metal alloys electrodepositions. A promising and new class of electrolytes among ionic liquids (Ils) are deep eutectic solvents (DESs)1 . The purpose of the copper deposition study from DESs is the application of copper coating and copper alloys in both, industry and fundamental research. In this work, the electrochemical deposition of copper onto palladium working substrate from ChCl/EG (1:2 ratio) DES electrolyte at 50°C was investigated. Additionally, the Cu(II) electroreduction process was studied by potentiodynamic measurements, cyclic voltammetry, chronoamperometry, in the electrolytes with different concentrations of Cu(II) ions ranging from 0.1 M to 0.5 M. The cyclic voltammetry results indicated that the bulk deposition of Cu(II) begins to occur at around –0.080 V vs. Cu. It was found that copper deposition onto the Pd cathode from ChCl:EG electrolyte under potentiostatic conditions is achievable. Data collected from X-ray diffraction (XRD) analysis proved that the cathodic deposits are composed of Cu and CuPd intermetallic. CuPd alloys with different Pd-Cu ratios were prepared by constant potential of –0.100 V vs. Cu from ChCl/EG containing 0.1 M and 0.5 M Cu(II). It is worth noting that the Xray data indicated that the composition of the produced Pd-Cu films could be varied by changing the concentration of Cu(II) ions in the electrolyte or changing the deposition mode.", publisher = "Society of Chemists and Technologists of Macedonia", journal = "26th Congress of the Society of Chemists and Technologists of Macedonia : the book of abstracts; September 20-23, Ohrid, Macedonia", title = "Copper Electrodeposition onto Palladium from a Deep Eutectic System Based on Choline Chloride", pages = "139-139", url = "https://hdl.handle.net/21.15107/rcub_vinar_11760" }
Cvetković, V. S., Nikolić, N. D., Košević, M., Barudžija, T., Dimitrijević, S. B.,& Jovićević, J. N.. (2023). Copper Electrodeposition onto Palladium from a Deep Eutectic System Based on Choline Chloride. in 26th Congress of the Society of Chemists and Technologists of Macedonia : the book of abstracts; September 20-23, Ohrid, Macedonia Society of Chemists and Technologists of Macedonia., 139-139. https://hdl.handle.net/21.15107/rcub_vinar_11760
Cvetković VS, Nikolić ND, Košević M, Barudžija T, Dimitrijević SB, Jovićević JN. Copper Electrodeposition onto Palladium from a Deep Eutectic System Based on Choline Chloride. in 26th Congress of the Society of Chemists and Technologists of Macedonia : the book of abstracts; September 20-23, Ohrid, Macedonia. 2023;:139-139. https://hdl.handle.net/21.15107/rcub_vinar_11760 .
Cvetković, Vesna S., Nikolić, Nebojša D., Košević, Milica, Barudžija, Tanja, Dimitrijević, Silvana B., Jovićević, Jovan N., "Copper Electrodeposition onto Palladium from a Deep Eutectic System Based on Choline Chloride" in 26th Congress of the Society of Chemists and Technologists of Macedonia : the book of abstracts; September 20-23, Ohrid, Macedonia (2023):139-139, https://hdl.handle.net/21.15107/rcub_vinar_11760 .